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Aluminum nitride (AlN) ceramics, with lattice constants of a = 0.31 nm and c = 0.498 nm, belong to the hexagonal crystal system and are fibrous mineral-type covalently bonded compounds based on [AlN₄] tetragonal units. AlN crystals are white or gray, with a decomposition temperature of 2200-2450°C at normal pressure and a theoretical density of 3.26 g/cm⁃. Their Mohs hardness is 7-8. Due to their high thermal conductivity, low dielectric constant, high resistivity, non-toxicity, matching thermal expansion coefficient with silicon, and excellent chemical stability and corrosion resistance, AlN ceramics have broad application prospects in the fields of electronics, energy, chemical engineering, transportation, and so on. In particular, their excellent thermal conductivity (theoretical thermal conductivity of 319 W·m⁻¹·K⁻¹) makes them an ideal heat dissipation and packaging material for the next generation of large-scale integrated circuits, semiconductor module circuits, and high-power devices.

AlN Heater

Aluminum nitride (AlN) ceramic heaters for semiconductors are devices used to heat semiconductor materials. Primarily made of aluminum nitride ceramic, they possess excellent thermal conductivity and high-temperature resistance, enabling stable operation at high temperatures. These heaters typically utilize a resistance wire as a heating element. Current is applied to the wire, causing it to heat, which is then transferred to the heater surface, heating the semiconductor material. Aluminum nitride ceramic heaters for semiconductors play a vital role in the semiconductor production process and can be used in processes such as crystal growth, annealing, and baking.

AlN Substrate

Aluminum Nitride ceramics are widely used as a substrate material in the radio frequency microwave electronics industry. They have a high dielectric constant, which can miniaturize circuits. They have good thermal stability and small temperature drift. They have high substrate strength and chemical stability, and their performance is better than most other oxide materials. They are widely used in electronic packaging, circuit substrates, and heat dissipation substrates for high-power devices.